Part two of a podcast of the ISS Technology Brief HP BladeSystem C7000 Enclosure, 3rd edition. This technology brief provides an overview of the HP BladeSystem c7000 Enclosure, including Thermal Logic power and cooling technologies and interconnect options.

Part one of a podcast of the ISS Technology Brief HP BladeSystem C7000 Enclosure, 3rd edition. This technology brief provides an overview of the HP BladeSystem c7000 Enclosure, including Thermal Logic power and cooling technologies and interconnect options.

Qualcomm increases data center scalability despite power, space, and cooling constraints with HP BladeSystem

This podcast explains why densification creates power and cooling challenges and how the technologies offered by the HP MCS G2 overcome them.

This podcast describes Power Regulator technology, how it can be used, and its relationship to other power management tools. It is assumed that the reader is familiar with ProLiant servers and the Integrated Lights-Out (iLO) management processor.